Table 2. Formulations of Epoxy Compounds (unit: phr)
| Ingredients | Compounds |
| 1 | 2 | 3 | 4 | 5 |
| Epoxy resina | 100 | 100 | 100 | 100 | 100 |
| CTBN | - | 1, 2, 5 | - | - | - |
| BC | - | - | 1, 2, 5 | - | - |
| ND or TNDb | - | - | - | 1, 2, 5 | - |
| CNT | - | - | - | - | 0.5, 1 |
| DICYc | 3 | 3 | 3 | 3 | 3 |
| DCMUd | 2 | 2 | 2 | 2 | 2 |
YD-128
Nanodiamond: ND for untreated nanodiamond, TND for treated nanodiamond with EHTPB
Curing agent, Dicyadiamide
Cure accelerator, Dichlorophenyl dimethylurea